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1红外智能传感与芯片检测技术研发中心

本研发中心由褚君浩院士领衔建立。研究采用高分辨率室温红外图像采集分析系统,结合主动红外辐照光源系统,实现在线热缺陷检测,有效提高器件缺陷检出率,提升芯片热稳定性。

The R&D center was led by Academician Chu Junhao. The research uses high-resolution room temperature infrared image acquisition and analysis system, combined with active infrared radiation source system to realize on-line thermal defect detection, effectively improve the detection rate of device defects and improve the thermal stability of the chip.

2固态激光及应用研发中心

本研发中心由祝世宁院士牵头建立。基于光子晶体激光芯片可开发高性能全固态与光纤激光系统及应用,可取代和升级现有的激光系统,广泛应用于芯片加工、环境监测、健康护理、化学分析、科学研究等。

The R&D center was led by Academician Zhu Shining. Based on photonic crystal laser chips, high-performance all-solid-state and fiber-optic laser systems and applications can be developed to replace and upgrade existing laser systems for chip processing, environmental monitoring, health care, chemical analysis, and scientific research.

3三代半导体射频和功率芯片及应用研发中心

本研发中心由郝跃院士领衔建立。基于氮化镓(GaN)的第三代半导体技术目前广泛应用于雷达探测、卫星通信以及即将到来的5G基站。到2022年,市场产值达10亿美元。研究院将引进国内最早系统从事氮化镓技术的研究团队,研究方向包括外延材料生长、器件设计及工艺、芯片及功率放大设计等。

The R&D center was established by Academician Hao Yue. Third-generation semiconductor technology based on gallium nitride (GaN) is currently widely used in radar detection, satellite communications, and upcoming 5G base stations. By 2022, the market value will reach 1 billion US dollars. The institute will introduce the earliest system research team engaged in GaN technology, including research on epitaxial material growth, device design and process, chip and power amplification design.

4半导体芯片检测技术及装备研发中心

功率半导体是几乎所有新能源相关产品的关键部件,然而散热问题是阻碍功率半导体发展应用的最大技术障碍。全球每年有上亿美元被投入到解决功率半导体散热设计问题上。目前对高可靠性功率半导体器件需求巨大。本项目的成功,将填补国内空白,为市场提供国际最先进的热测试/热设计解决方案,帮助中国企业提高在功率半导体领域的产品竞争力。

Power semiconductor is a key component of almost all new energy related products, but the heat dissipation problem is the biggest technical obstacle to the development and application of power semiconductors. Every year, hundreds of millions of dollars are invested in solving the problem of power semiconductor thermal design. There is currently a huge demand for high reliability power semiconductor devices. The success of this project will fill the domestic gap and provide the market with the most advanced thermal testing/thermal design solutions to help Chinese companies improve their competitiveness in the field of power semiconductors.

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